Development device
Development process after exposure of wiring patterns! Introduction of development equipment powered by AC 200V/220V, 50Hz/60Hz.
We would like to introduce our "Developing Equipment." This equipment is capable of developing after the exposure of wiring patterns. The processing surfaces can be single-sided or double-sided. The equipment configuration includes unwinding, developing, rinsing, liquid removal, drying, and winding. 【Specifications】 ■ Lane configuration: 2 Lanes ■ Transport speed: 2.0 m/min ■ Material width: 35mm to 160mm for TAB/CSP/COF (250mm to 300mm for FPC) ■ Material thickness: PI 25μm and above ■ Processing surface: Single-sided and double-sided *For more details, please refer to the PDF document or feel free to contact us.
- Company：SETO ENGINEERING 守谷事業所
- Price：Other
